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ArqonixGen Semiconductor Pvt Ltd

Silicon designed with intelligence built in.

Fabless semiconductor design Bengaluru, India
Drag to orbit

A deep-tech company at the boundary of hardware and intelligence.

ArqonixGen Semiconductor is a fabless chip design company based in Bengaluru. We work across the full design flow, from architecture and RTL through verification, physical design, and sign-off, and we bring the same discipline to the AI systems that run on that silicon.

Hardware and software are designed together from the start. That is how efficiency that neither side can reach alone gets built into the chip rather than bolted on afterwards.

The design flow we run, with the two feedback loops that matter most: verification back into RTL, and physical results back into synthesis.

What we do

Six capabilities, one design flow

From tape-out to deployed models, each capability is staffed and tooled as part of a single flow rather than as a separate practice.

01

VLSI and SoC design

Custom chip design from RTL to GDSII, with power, performance, and area targets set at architecture time and tracked through sign-off.

RTLPhysical designDFTSign-off
02

AI chip architecture

Purpose-built neural processing units and accelerators, designed around the workloads they will run and the power envelope they must fit.

NPUGPU IPTensor coresSIMD
03

Edge AI

Inference engines optimized for constrained devices, so real-time AI runs locally without a dependency on the cloud.

TinyMLQuantizationONNXIoT
04

AI and ML platform services

End-to-end machine learning pipelines: data engineering, training, optimization, and production deployment.

MLOpsLLM fine-tuningAutoML
05

Embedded security IP

Hardware root of trust, secure enclaves, and cryptographic accelerators integrated at the silicon level.

PUFHSMTEECrypto IP
06

Verification and validation

Functional verification with UVM, formal methods, coverage closure, and AI-assisted test generation to catch issues before silicon.

UVMFormalCoverageEmulation
A valid/ready handshake and a coverage map. Verification is a first-class capability, not a final checkpoint.

Deployment targets

Designed for where it has to run

The same design flow serves three very different power and latency envelopes. Each one pushes back on the architecture in its own way.

A spine and leaf fabric over racks of accelerators. Throughput per watt decides how much compute fits in the envelope.

01 · Data center

Compute measured per watt, not per chip

At rack scale the limit is rarely the transistor. It is the power and cooling budget, the memory bandwidth feeding each accelerator, and the fabric between them. That is the class of system our AI chip architecture and security IP work is aimed at.

    Accelerator SoCMemory interfacesRoot of trustThermal budget
A systolic MAC array. Weights descend, activations cross, and the compute wavefront moves diagonally as partial sums accumulate.

02 · AI systems

The array is only as fast as the data reaching it

A multiply-accumulate array is easy to draw and hard to keep fed. Stalls come from the memory hierarchy and the schedule, not the arithmetic, so we shape the datapath, the on-die memory and the compiler together rather than in sequence.

    DataflowQuantizationCompiler co-designBandwidth
Sense, infer, act. On a moving machine the loop has to close locally and on time, inside a few watts.

03 · Robotics and edge

A deadline the cloud cannot meet

When a machine is moving, a late answer is a wrong answer. The loop has to close on the device, within a fixed time budget and a few watts, which is what drives quantization, scheduling and the accelerator design long before tape-out.

    Real-time inferenceTinyMLDeterminismPower envelope

We own the stack from transistor-level design to deployed AI services. That removes integration friction between teams that usually never meet, and it shortens the path from concept to product.

Why ArqonixGen

Built at the intersection

Silicon-native AI

Our AI architectures are co-designed with the hardware from day one. The model, the compiler, and the datapath are shaped together, not negotiated after the fact.

Research-led engineering

We follow current research closely and translate what holds up into production-ready silicon and AI systems, with the engineering rigor that tape-out demands.

Full-stack capability

One team spans RTL, verification, physical design, firmware, and ML deployment. Fewer handoffs means fewer surprises late in the schedule.

How we work

Four stages, no silicon surprises

Every engagement runs through the same four stages. Targets are set early, verified continuously, and carried through to deployment.

01

Discovery and specification

We work through your requirements, define performance targets and power budgets, and choose the architecture that fits the use case.

02

Design and modeling

RTL development, AI model development, and co-simulation validate the hardware and software interface at the earliest possible stage.

03

Verification and sign-off

Functional coverage closure, timing closure, and DRC and LVS sign-off, supported by AI-driven test generation.

04

Deploy and optimize

Tape-out or cloud deployment, followed by monitoring, model refinement, and iterative performance work after launch.

Design flow and tooling

Industry-standard tools across the flow

DomainLanguages and standardsTools and frameworks
Front-end designSystemVerilog, RISC-V ISASynopsys Design Compiler, OpenROAD
VerificationSystemVerilog, UVMQuesta Sim, formal and emulation flows
Physical design and sign-offGDSII, DRC and LVSCadence Virtuoso, Mentor Calibre
AI and MLONNXPyTorch, TensorFlow, CUDA, ONNX Runtime
Cloud deploymentMLOps pipelinesAWS Nitro

Tool names are the property of their respective owners and are listed to describe the flows we work in.

Reading list compiled from a public roundup shared by @rishitlalan_16. Descriptions and diagrams here are our own; each site belongs to its respective author.

Work with us

Ready to build smarter silicon?

Tell us what you are building. We will come back with an honest view of the architecture, the schedule, and where the risk sits.